Electronics Forum | Fri Jan 23 18:03:06 EST 1998 | Steve Gregory
Paul, I've got a third-level ISO Stencil Specification procedure that I did at a past employer that I'll send you...it also deals with the DEK-265 printer (which is what we used) when I talk about frame sizes and image positioning, but you can edit i
Electronics Forum | Tue Aug 07 04:19:38 EDT 2001 | wbu
What happend yesterday (06.August.) that Netscape isn�t good anymore for viewing the pages of SMTnet? Same thing with Apple computer and Netscape. Had to find someone with MS explorer installed to get this out. Hope it�s not a discrimination or somet
Electronics Forum | Tue Aug 07 12:18:37 EDT 2001 | delnosa
Looking at ideas for "best in class" process controls for SMT mfg. ops. Wanting to add improved p-controls at some of our suppliers and I'm looking at what others may or may not recommend. Already looking at the following: Solder Printing X-Y-Z axis
Electronics Forum | Tue Aug 07 16:12:13 EDT 2001 | Michael Parker
In addition, consider: Solder paste selection, including clean or no-clean is also quite important. This can vary from application and is somewhat process dependant (what works best in the environment). Relow profile. A must for many reasons. And
Electronics Forum | Wed Aug 15 08:05:44 EDT 2001 | wbu
Oh boy, I prefer the fillet at heel of course, the toe you can�t trust. The solderable finish of the leads is applied and than the leads are cut leaving the toes without this so much loved finish. guess how that looks after you�ve finished your job.
Electronics Forum | Wed Aug 15 17:30:43 EDT 2001 | peterson
Hello All, We have an MPM 2000 screen printer. My question is this: we are having a stencil made that has both top and bottom side on a single foil. Our Process people are unsure if the machine parameters will allow it. The board size is 19x15. Can i
Electronics Forum | Wed Aug 22 20:18:17 EDT 2001 | mcox
I can send you a DOE I did on WS vs NC on BGA�s, but the results were.. NC = Had significantly less voiding both in number of voids and size of voids. A longer soak time (reflow oven) resulted in less voiding both for NC and WS. Mike
Electronics Forum | Tue Sep 04 08:40:45 EDT 2001 | caldon
I have input about EMPF but my opion is biased. One thing I can tell you that is a fact- the classes are 40% theory and 60% "hands-on". The 60% "hands-on" utilized the latest in manufacturing equipment. No hotel conference room, training is done r
Electronics Forum | Tue Aug 21 13:20:47 EDT 2001 | LloydG
Greetings! I would appreciates any inputs to all tech pros & Engineers: As responsible for manufacturing engineering for our PCA products(OEM/Telecom) am planning to implement a company-wide implementation of DFM/DFT. Am looking for a software that w
Electronics Forum | Thu Aug 23 11:55:21 EDT 2001 | wbu
TA, is there somebody out there who can bring on the right track according adequate materials for long term storage of assembled boards (at least 10 years)? It�s for spare parts for future service exchange. The units should be stored seperately and
