Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Wed Sep 26 11:54:02 EDT 2001 | Stefan
John, you mention yourself that this problem is component related. Is the 1206 presented out of a plastic tape?. The tape could be more slippery than the paper tape and the cover tape may pull the tape out of position. I am not familiar with the Juk
Electronics Forum | Wed Sep 26 16:31:30 EDT 2001 | davef
Wudduya mean ya can�t replace that ol� John Trieber? We agree. * Waverider thingies are best used to set-up process and in machine start-up. * Monitoring product characteristics is expensive, gives little information, and is so sloooow. [Plus we tu
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Tue Oct 09 12:04:37 EDT 2001 | Mike
Has anyone looked at setup reduction for machine feeders. We have made some gains through changing the flow of work but as lot sizes decrease the number of parts required remains the same. We remove all reels from the feeders after a job is complet
Electronics Forum | Mon Oct 15 17:28:14 EDT 2001 | Brian W.
Boy, does this sound familiar. I agree with Dave, especially his point about board side taping. The kapton tape has a thickness of approximately 2mils. You artificially increase your paste thickness with this method. It also can be a cause for br
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
Electronics Forum | Fri Oct 12 14:19:03 EDT 2001 | David Brink
Steve Often solder mask is the only solution but in many cases there is enought space between smt and thru-hole to utilize a component masking wave solder pallet. The advantage to a pallet is consistancy of results and excellent protection of masked
Electronics Forum | Tue Oct 16 11:51:26 EDT 2001 | bobm
i am using the epibond. i had alpha come in and look at our set up. they told me that the epibond can be reflowed at regular temp profiles with no problems. because i only have one oven and two pick n place machines it was important to be able to run
