Electronics Forum | Fri Oct 08 07:26:22 EDT 2010 | walkbury
Yes... I can generally get away with it for all but the low profile stuff such as tssop packages. The plastic tubes are so shallow anyway that once you've used a scalpel to create a pick up window, you've virtually got no side-wall left. Anything b
Electronics Forum | Tue Oct 26 00:03:09 EDT 2010 | jmelson
Hmm, that's a fairly old machine, even older than mine! (I have a CSM84 PA130640). Anyway, it is best to program the machine from CAD system data, I wrote a little program in C to read in the component type and XYR position, and produce the file in
Electronics Forum | Mon Nov 01 12:32:03 EDT 2010 | jj12345
I have a question regarding the csm66, i have that particular machine - but have 2 problems : (1) Movement speed - its set at 100% but just crawls in the run mode .. i dont understand why. (2) I have a teaching camera but it does not recognize it i
Electronics Forum | Thu Oct 14 17:14:22 EDT 2010 | bdavis63
Hello All, I am looking to increase Selective Soldering capability and am looking for insight as to what equipment/manufacturer to persue. I am looking for a small footprint, fully wetted batch system that can be easily upgraded to in line function i
Electronics Forum | Wed Oct 20 19:02:30 EDT 2010 | swag
We've done many fine pitch parts using only global board fids with good results. However, if you're working with flex or flex/rigid designs, I would never use global or panel fids for fome pitch placement. We always request addition of local fids u
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
Electronics Forum | Tue Nov 09 20:52:34 EST 2010 | ppcbs
Yes, we have had this happen with certain solder masks over the years. Hot air gun is the best solution we can find if the oven doesn't do it. Back in the day when we had a vapor degreasor, freon based solvents would also remove the clouding. Let
Electronics Forum | Fri Nov 05 12:25:42 EDT 2010 | deanm
I think you are right. According to IPC-7526 section 6.2 says that using compressed air to blow out paste will damage the stencil, especially between fine pitch apertures. It can also broadcast solder paste onto other surfaces or personnel. I recomm
Electronics Forum | Mon Nov 08 13:14:35 EST 2010 | rway
If you are just wanting to test the values of the electrolytics or tantalums, it's not a problem with an ICT, as long as your system has an analog instrument to do it. If you are wanting to test the polarity of the cap, you will need a capacitive co
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
