Electronics Forum: can (Page 2051 of 2410)

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG

We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w

Nitrogen purity requirments

Electronics Forum | Thu Jun 29 10:45:46 EDT 2006 | stepheniii

We have an ERSA Versaflow Ecoselect selective wave soldering machine. It works well except it needs nitrogen. You can't even move the table around if your nitrogen tank is empty. The spec sheet says Required degree of purity: Nitrogen liquid 5.0

SIR Testing

Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang

Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re

SIR Testing

Electronics Forum | Thu Jul 06 16:00:11 EDT 2006 | samir

Ionic Cleanliness Testing: IPC-TM-650, Test Method 2.3.25, Section 5, "Dynamic Extraction Method", is the most commonplace method in the industry to test YOUR PCBA's for cleanliness. Run it through your process as normal, and send it out for testin

and you think youve got it hard

Electronics Forum | Mon Jul 10 16:00:43 EDT 2006 | samir

QE's are the guys that sit in meetings asking the process guys --- "Uhhmmmm....my pie chart here says that we have 11 solder shorts on U1 for the week. WHAT'RE YOU GONNA DO ABOUT IT?" Unfortunately, most QE's dress nice, are tall, have gelled slic

PCB Baking

Electronics Forum | Thu Jul 13 00:50:43 EDT 2006 | Ola

I hate to say this, but there are some good threads already at this forum. Please do a search on this topic and you will find some interesting answers. For. ex. http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=5939&#Me

PCB Blistering / Delamination

Electronics Forum | Tue Jul 18 18:53:23 EDT 2006 | Mike F

Is it showing up after wave or reflow soldering, or after hand soldering? If the delamination or blister bridges between traces you have the potential for a short circuit between those traces. A delamination might be repairable, but in most cases i

SMT p&p new line

Electronics Forum | Thu Jul 20 11:28:40 EDT 2006 | Rob

Mydata are OK, but they will not last as long as the Siplace if running the same volume. They are easy to programme, change over & upgrade - they are very good entry level machines. One thing to remember is that they make use of large scale gang pi

EL Cap _ Missing & Shifted out of the Copper Pad

Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob

Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi

Functional Test Faulure due to BGA ICs

Electronics Forum | Fri Jul 21 16:47:17 EDT 2006 | stepheniii

Does replacing the BGA fix the problem? To be a little more blunt, is the BGA or is it the tech says it's the BGA. Beleive none of what you hear and only half of what you see. What kind of BGA is it? If it is one of those BGA's with a built in heats


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