Electronics Forum: can (Page 2216 of 2409)

Re: BGA reflow profile

Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach

Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs

Re: PTH connectors mounted on SMD process

Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward

I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is

Should I manufacture my own boards or outsource them?

Electronics Forum | Sun Dec 19 23:27:22 EST 1999 | Mike

Should I manufacture my own boards or outsource them? Any opinions are welcome. I own a company and sell electronic products. Some products we sell have specific ad-on circuit boards which I have designed and had manufactured just for my company. The

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

Re: Soldering long lead thru hole parts

Electronics Forum | Thu Dec 09 23:57:41 EST 1999 | Jeff Sanchez

Mike, A drag solder system is not so bad. If it's not discoloring the silk screen , damaging your parts or blistering your boards than it looks like a safe bet. I am not sure what other components you have on the boards besides the LED's? But the

un-tested assembled circuit reject rates

Electronics Forum | Tue Dec 07 13:40:25 EST 1999 | Tim

The company I represent provides electronic manufacturing services. Some of my customers ask that we ship their boards "un-tested". By un-tested I mean we build them, visually inspect them and out they go. I find that on un-tested boards, it's not

Re: Noclean soldering to gold

Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ

Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to

Re: In House or Out

Electronics Forum | Wed Dec 01 13:19:52 EST 1999 | Wolfgang Busko

Hi Dick, first of all I will not judge what�s the best in your case for I don�t know all details of your situation. Just my opinion: As a matter of fact the amount of THT is rapidly decreasing compared to SMT. So, to stay in assembly business it vita


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