Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
Electronics Forum | Fri Mar 19 19:13:57 EST 1999 | Earl Moon
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Thu Mar 18 17:18:22 EST 1999 | Earl Moon
| | Hi folks, | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and
Electronics Forum | Tue Mar 16 19:25:32 EST 1999 | Earl Moon
| | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | Thank you | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And it will get hotter if
Electronics Forum | Tue Mar 16 20:09:01 EST 1999 | Wayne Bracy
| | | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | | | Thank you | | | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And it will get
Electronics Forum | Tue Mar 16 20:17:13 EST 1999 | Chris G.
| Are stencils universal from one printer to another? We are looking into the possibility of going from Solderprint 1414 manual printer to a more automated printer. We are also considering bringing some boards we currently outsource in house. I w
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Mon Mar 08 10:44:07 EST 1999 | Matt Stackhouse
| Hello; | | I am looking for general info on backplane assemblies. Any info would be appreciated, but some of the questions that come to mind include: | | -What part types other than connectors do backplane cards have on them? SMT? Leaded? Qua
Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon
I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo
Electronics Forum | Sat Mar 06 08:19:50 EST 1999 | Dave F
| Clarissa, | | Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for t
