Electronics Forum | Fri Apr 14 10:16:27 EDT 2000 | PeterB
Dave, 'Free Issue' here in the UK means material (be it PCB's or anything else) supplied by our customer from their stock and not charged to us. That is why we sometimes cannot control the design parameters. Many thanks for the suggestions. We alre
Electronics Forum | Sat Mar 18 13:44:31 EST 2000 | Thomas Ravener
I totally agree. I like the text of Greed Exhibitions, very fitting. I too was an exhibitor. We were in the other... hall. The first day was lacking in the excitement and hustle and bustle of the main floor. APEX did a good job in correcting the lack
Electronics Forum | Wed Jan 17 21:05:47 EST 2001 | davef
When selecting any issue of the newsletter ... The page cannot be found The page you are looking for might have been removed, had its name changed, or is temporarily unavailable. Please try the following: If you typed the page addr
Electronics Forum | Tue Feb 13 14:59:48 EST 2001 | vargas_s
I have an application where a customer cannot get a 14 lead TSSOP device in time for his needs (his board design is fixed). He can however get the same device in a 16 lead SOIC wide body package (two leads are not used). Has anyone come across a cost
Electronics Forum | Wed Apr 04 12:35:15 EDT 2001 | davef
These solder balls are where [top / bottom]? Describe the breadth and degree of this problem across all assemblies. Finally, describe your wave solder machine, a common profile for this board, and the board [beyond that it's mixed tech, like are
Electronics Forum | Wed Sep 12 12:55:34 EDT 2001 | stevearneson
The CyberOptics LSM 300 cannot provide true 3D volumetric measurements. It is impossible to measure volume using a "Box" that is drawn around a feature without the same characteristics. Owners of the LSM 300 try it for yourself. Move the stripe ar
Electronics Forum | Fri Jun 29 13:54:43 EDT 2001 | Brian W.
I have had some conversations with MPM about the Rheo pump. They have some data to support the change from an ROI standpoint. One of their customers has seen a dramatic decline in the amount of wasted paste, resulting in a very large cost savings.
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Mon Jun 25 10:35:39 EDT 2001 | rkevin
Despite all my efforts I cannot eliminate icycling on my t/h leads. They come and go.... daily, lots of rework. I have eliminated the following from the scenrio: Inadequate flux to promote quick drainage, Pot temperature too low, Soldering surface
Electronics Forum | Wed Aug 01 11:11:38 EDT 2001 | JohnW
hi Folk's, Ok so I'm looking for some thoughts on Conductive Epoxy's. I'm trying to replace a material that i can place between a QFP and the PCB to transfer heat from the component to the PCB. The material has to be able to be injected thro' a hole