Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Fri May 31 16:16:42 EDT 2002 | Ozzy
Does Fuji even make the QP-132 anymore? I have not seen it at Apex for the past 2-3 years. This "inflexible" dinosaur was a commercial disaster for Fuji. Philips/Assembleon has sold countless more FCM than Fuji QP-132. The problem with both machines
Electronics Forum | Tue Apr 23 13:51:03 EDT 2002 | Ken Bliss
We get inspected regularly and the only items we have had to ground where flammable liquid drums or a drum that had flammable or explosives fumes (partially full), I cannot see any reason why they would require grounding if no hazard was present. We
Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc
First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin
Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions
Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik
Electronics Forum | Wed Jun 05 14:43:33 EDT 2002 | davef
Steve, As a reason for cleaning no-clean flux res: Well, maybe some of Por's products / customers can live with NC flux res, while others cannot accept it. So, rather than running two fluxes Por finds it simpler to clean the NC flux res. For us,
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Mon Jul 22 13:16:35 EDT 2002 | Claude_Couture
We are drifting deeper into market philosophy... Yes, capitalism is the motor to a healty market economy. "Running to catch up on the latest gadgets even if my 10 year old cell phone is still working fine and fills all my needs" cannot be sustained.