Electronics Forum: capability (Page 146 of 182)

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind

Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste

PanaPro System

Electronics Forum | Fri Jan 20 05:30:11 EST 2006 | pavel_murtishev

Good day, You are right. PanaPro system isn�t very easy to use; it�s rather complex system, but very flexible and very powerful. It has a powerful core together with a lot of useful software functions. For example build-in text post-processor, good

Questions on J-STD-033A procedure (Table 4-1)

Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane

I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component

Paste in hole (sate of the art)

Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach

We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la

Tin Lead BGAs in leadfree paste

Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm

Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r

Siemens S15/F3 skipping component

Electronics Forum | Tue Apr 11 11:40:41 EDT 2006 | global

We have a Siemens S15 and an F3, which we have only had now for about 4 months. We have an old line of HS180s and an SP120 and have found that the S15 and F3 do not have the option to skip a part if one runs out during placement. We from time to time

SMT Assembly Line

Electronics Forum | Fri Jun 02 13:05:42 EDT 2006 | stempfle

Efren, Most of the previous posts offer valuable information. Certainly you should consider panelization of the individual circuits. Otherwise you'll waste valuable production time passing 3" boards along the line. Your orig estimate of min thruput

Need help for setting up an assembly line

Electronics Forum | Mon Jun 19 22:19:40 EDT 2006 | Nathan

Dear All, We plan to setup an assembly line for our small volume production of PCBs (about couple hundred PCBs per week). The board has about 150 components (less than 30 types) and a few BGA and IC (majority is SMT, only few THT connectors). We hav

mpm up2000 backdoor?

Electronics Forum | Thu Jun 22 10:22:28 EDT 2006 | PWH

I've done this stuff on UP3000's and AP's so hopefully my advice will help with your 2000... You can get into all upper level user modes, correct? You don't mention test, cal. or field service mode. If you can't get into those, I can send you a pr

cem audit check-list

Electronics Forum | Thu Jun 29 13:27:20 EDT 2006 | pjc

Verify that the CEMs machines and processes are capable of assembling the technology of your boards- smallest components, largest components, finest pitch, flex circuits, etc� Are their core competences aligned with your requirements- assembly only,


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