Electronics Forum | Thu Jul 11 06:56:30 EDT 2002 | davef
We have had failure due to a leakage in one ceramic chip capacitor. External inspection did not show any obvious damage. Cross section showed a void in the capacitor. The void was an elliptical shape and positioned longitudinal to the length of the c
Electronics Forum | Fri Jul 12 08:26:51 EDT 2002 | davef
We sent the sectioned capacitor to our supplier for analysis. So, the results of their analysis is probably in a file drawer someplace.
Electronics Forum | Sat May 03 14:06:25 EDT 2014 | jyo_409
What are the possible reasons for electrolyte leakage What is the purpose of the vent in the capacitor? Why vent is not being maintained for all types / values of the capacitors? What is the significance of the end seal configuration. Why end seal co
Electronics Forum | Sun Apr 04 10:16:16 EDT 2004 | cyclopsn
I'm involved in backplane manufacturing process. There are about 10 electrolitic capacitor assembled in my board.These capacitor are soldered using a selective soldering machine. My problem is that these capacitor will charged up and failed as short
Electronics Forum | Wed Jul 10 04:53:47 EDT 2002 | redmary
a leakage exists in the capacitor net (1206), which cause the voltage down so much. the process flow is: printing-placement-reflow-hand load-wave-depanel-FT. I find possible stress maybe exists in the depanel stage, does the extra stress cause the ca
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Fri Jul 12 01:38:06 EDT 2002 | redmary
thanks, Dave. who are specialized in mechnical stress distribution? because I find the gap in the capacitor, but why? If the crack is caused by the exteral mechnical stress, which shape will be formed, zigzag or linear?
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Mon Apr 05 08:23:17 EDT 2004 | davef
While a temperature, check the AC voltage to ground on the tip of your selective soldering machine.
Electronics Forum | Wed Jun 15 10:26:32 EDT 2005 | russ
How is the perpendicularity of this cut nozzle?
