Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu
Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram
Electronics Forum | Mon Mar 26 09:41:03 EDT 2018 | fuji_user_2014
Hi Gurus, Looking for alternatives to line makeup after reflow oven. Currently, I have a continuous on flat belt conveying out of my reflow oven straight to an EOL bench. The operator manually picks up the board off the belt (there is a roller at t
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro
Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede
Electronics Forum | Tue Oct 02 07:23:37 EDT 2001 | cath
Has anyone caried out a DPM analysis on these components. I would be interested to know the defect rates and other assoc. placement issues as we have never placed them before. Thanks, cath
Electronics Forum | Fri Feb 16 11:07:25 EST 2007 | stepheniii
I'm not sure if anyone mentioned the single most important factor. p.m.'s. If the nozzles are getting dirty and clogged it's not going to do a great job of picking parts up. Don't think in terms of variation. It's there it's unavoidable and undet
Electronics Forum | Tue Oct 12 08:12:20 EDT 1999 | robert parker
any advice on smt resistors and capacitor that can survive an explosive shock. the ceramic smts are not, plastic ic's and discretes do fine.
