Electronics Forum | Fri Oct 27 13:49:11 EDT 2000 | dpoling
We are currently having problems with tombstoning and minor lifting on small SMT stasck film capacitors. Does anyone have any ideas?
Electronics Forum | Sat Oct 28 08:41:37 EDT 2000 | Aaron
1. Check printing accuracy. 2. Check placement accuracy. 3. Your components should be kept in a good environment to prevent oxidation of terminations. 4. Pads pattern should be designed according to standards. If 1.2. are okay, you should suspect 3
Electronics Forum | Wed May 27 13:50:38 EDT 2015 | ingallsd
I saw a question regarding the acceptability of stacking chip components at this forum posted in 2000. Unfortunately no one could cite any applicable IPC sections at that time. I am now able to find that this is acceptable per IPC-A-610D, Section 8.
Electronics Forum | Tue May 02 15:25:22 EDT 2017 | mrk
Hi, We have recently been tasked with producing a PCB assembly that requires a chip resistor to be stacked on top of a chip capacitor (both are 0603 package size). This becoming a more common practice, I was wondering if anyone has been successful i
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Thu Dec 30 21:51:47 EST 1999 | Dave F
Jason, if you're considering: * "Stacking" components, it's a bad idea because you're reducing the surface area of the lower component, which is required for heat (power) dissipation. * Multiple components side-by-side or end-to-end, it acceptable
Electronics Forum | Fri Jun 11 06:10:07 EDT 1999 | Steve
Hello everyone, I am currently looking for a test handler for memory module applications. The one I have seen stacks the modules on top of each other. I am worried that this contact may damage the capacitors on the modules. Does anyone have any exper
Electronics Forum | Mon Mar 08 15:37:41 EST 2004 | pdeuel
What type of P&P machine? Useing any Placement force? Ramp speed in reflow? PCB thickness properly defined? Tooling supports too high? Any doubble stacking of parts? Occuring with only one part manufacturer? Start with processes where problem is note
Electronics Forum | Wed Aug 22 13:18:50 EDT 2012 | rway
I also forgot to mention that the pizza-slicers you are using can get out of spec and may need periodic calibration. By cutting too close, these can over-stress your pcbs as well. Do you only see this problem at one cutter or does it matter? Also,
Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
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