Electronics Forum | Wed Jul 02 19:20:43 EDT 2003 | teamcanada
Have you looked into Kapton tape as a protectant?
Electronics Forum | Wed Jun 25 08:58:02 EDT 2003 | cyber_wolf
I need something that is very thin so I can screen print while the fingers are protected. We have tried cleaning the fingers prior to shipment, but our customer tells us that even alcohol leaves enough residue to cause problems.
Electronics Forum | Thu Jul 03 11:36:57 EDT 2003 | Ron
Have you considered a temporary water washable solder mask. Elvaway solder mask tapes have been protecting Gold Fingers during soldering and simply wash away in a water wash process and leaves no residue.
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Wed Dec 18 07:22:23 EST 2013 | davlec
We have not tried VectorGuard, so I cannot comment on that specific solution. However we have been using a Tecan Genesis system for several years and are very pleased with it. Unlike the DEK solution, the tensioning is entirely mechanical so there is
Electronics Forum | Fri Nov 13 20:17:35 EST 1998 | Chuck Garth
| | I believe that gold fingers on my circuit boards are being | | contaminated and need to clean them with some chemical | | solution. Any recommendations. | | | Chuck: What is the type and source of your contamination? Dave F | We are using a s
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
