Electronics Forum | Wed Jul 21 19:59:42 EDT 1999 | Deon Nungaray
| I am curious as to what everyone is thinking about having both the Nepcon and Apex showsn next spring? Will people be attending Nepco, Apex, both or are we seeing the industry tradeshows saturating us? We are trying to evaluate these as an exhibit
Electronics Forum | Tue Jul 20 09:20:39 EDT 1999 | Dave F
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Thu Jul 15 16:07:39 EDT 1999 | Doug
| | I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspec
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Mon Jul 05 02:32:14 EDT 1999 | Vinesh Gandhi
Dear All, We are a medium sized Electronic manufacturing company manufacturing computer motherboards and Telecommunication products. We have a big debate going on within our company regarding the defect rate measurement technique. At present we
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Mon Jun 07 10:52:04 EDT 1999 | Brian Wycoff
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Electronics Forum | Mon Apr 26 14:04:59 EDT 1999 | Steve Gregory
Hi Murray! Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads. OSP's hav
Electronics Forum | Wed Apr 14 12:46:38 EDT 1999 | justin medernach
| | | Thanks all you kind and knowledgeable folks. I no longer will be participating in this forum. | | | | | | After careful consideration, I have come to the conclusion registration, in the manner required to participate in what was an open forum
