Electronics Forum: caring (Page 91 of 127)

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Thu Aug 23 00:10:21 EDT 2001 | mugen

Looky here people, 1) did imply *my* APPRECIATION for the replys posted herein... 2) If *me* appears to have no contribution to the forum, hope someone out there vaguely recalls some infrequently posted info *me* posted, that did get some joy & tha

Solder Joint Strength

Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef

Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve

To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de

glue measurement

Electronics Forum | Wed Oct 10 02:44:47 EDT 2001 | djarvis

Frank, Don't know about point 1 but if they don't fall off I don't worry about it. If they do fall off it's generally because someone has mishandled them before the wave, like shoving them into racks and the like. If they have fallen off and you can'

Solder Mask Specification

Electronics Forum | Wed Oct 24 18:09:44 EDT 2001 | davef

Allowing the board fabricator to define the board you expect to receive is fine, as long as they do a good job. Regardless of the existence of a clear product definition or not, it�s reasonable for you to argue that your receipts must meet the requi

SPC on SMT

Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen

Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas

stencil cleaning

Electronics Forum | Thu Apr 11 19:12:11 EDT 2002 | djarvis

Sorry fellas -disagree. We only clean our stencils in the ultrasonic machine at the end of the run. If the same pcb is up the next day we clean them by hand. We use Electrolube SSS and the used rolls from the in line under stencil cleaner. Wipe the

Rippling effect of stencils

Electronics Forum | Fri Jan 10 15:02:03 EST 2003 | John

Hi. I am familiar with the Transition blades. Normally, when there is metal to metal contact, as in the squeegee-stencil situation, there will be scratches, or a "brush pattern". Sometimes it takes the pattern of the high profile surface elements u

Solder Paste Inspection System.

Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon

I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para

Solder Paste Inspection System.

Electronics Forum | Wed Mar 06 17:15:06 EST 2002 | djarvis

Hmmmm, very good point. I never thought about it much as such dedicated tools were not available when I first kicked off. I'd look at the reflow under a microscope and if I could identify any problems, I'd start to look at the print using the same


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