Electronics Forum: casing (Page 141 of 246)

Fuji IP3 clamping problem Fixed!!!!!!

Electronics Forum | Wed Mar 20 13:49:15 EST 2002 | cabjerk

Hi All; The following is from our Support people who worked with Fuji on the problem; Last week Luke Mittur and John Gudel were in from Fuji to address the IP3 issue outlined below. The problem ended up being that the table "up" and table "dow

ROI on AOI Machines

Electronics Forum | Thu Mar 07 16:53:55 EST 2002 | PeteC

The AOI machines are basically to replace human inspectors. They certainly do a better job. First you have to look at why is there so much inspection. Usually its becuase people have no confidence in thier processes or lack the knowledge to create an

Flux residue effects on circuit performance?

Electronics Forum | Sun Apr 28 07:34:34 EDT 2002 | hany_khoga

Dear Tom : I hope I �m not too late. We produce PC motherboards with some buses exceeding the speed of 100MHz . we use no clean flux and it is OK even with the residues you can see under a microscope. But according to our own experience through a mo

Agilis Feeders

Electronics Forum | Mon Apr 29 10:14:20 EDT 2002 | cyber_wolf

With all due respect, it is my experience that "some" design engineers should spend at least some time in a production type enviroment. It gives a real sense of how things actually act when put into daily action. I realize that the specs manufacturer

Au Plating

Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef

First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi

AOI vs AXI

Electronics Forum | Sun Jun 09 19:02:15 EDT 2002 | Ken G.

Sam, I can tell you right now that if you have a low volume hi mix application where the program/job is changing every day, an AXI system is not going to be a good fit. As you alluded to, the programming time is onerous, the fine tuning or tweaking i

Placement machine comparison

Electronics Forum | Mon Jun 17 09:41:41 EDT 2002 | caldon

I always look into the Support Structure (Service, Applications, Training, Project/product management) of the organization. With that said I have to give Assembleon the edge. I also like the relationship between Cookson and Assembleon. Cookson Perfor

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef

See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th

SMT COMPONENTS

Electronics Forum | Mon Jul 15 15:54:53 EDT 2002 | davef

Ken: Responding to your comments: * If buyers were to communicate better and be more involved with manufacturing, they would make less money. [1] There�d be fewer cases of �Jack� on the home doorstep at Christmas-time. [2] The buyer�s budget would

ENIG poor wetting

Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef

When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate


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