Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Thu Dec 02 11:54:50 EST 1999 | John Thorup
I'll have to second Boca. I have used the TA blades exclusively for three years and have never seen the coating come off. I think you'll be able to make a case for your bean counters. John Thorup
Electronics Forum | Tue Nov 23 09:58:46 EST 1999 | STEVE CACCIOLA
I'm not a chemical guy, I'm a cleaning system guy. From my experience, lead does not normally go into solution unless there is an additive to your water (i.e saponifier), and if this is the case, you will need a membrane system (R.O.) to get it back
Electronics Forum | Mon Nov 08 11:11:16 EST 1999 | John Thorup
Believe it! Although it might be necessary in certain rare cases, and as Ray says, as a bandaid, to routinely bake your boards is a mistake. For much more info, search the IPC technet archives over the last few weeks. It was a popular thread
Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca
Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca
Electronics Forum | Fri Oct 22 14:43:03 EDT 1999 | Clifford Peaslee
Brian, That should be the case, and I will check it to see if it does have that information showing. The leading message should contain all forums that all messages in the thread to which they pertain. It is currently capped at 4 icons, so that it
Electronics Forum | Thu Sep 03 11:31:43 EDT 1998 | Ben Salisbury
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Mon Jul 20 23:09:27 EDT 1998 | Stoney Tsai
We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. Thx for any information Best Regards, Stoney Tsai
Electronics Forum | Sat Aug 15 07:52:48 EDT 1998 | Clyde F.
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai
Electronics Forum | Mon Dec 08 19:40:59 EST 1997 | Alan Brewin
I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. I know that they used to use CFC's but apparently this is no longer the case? Can anyone help with some info? Thanks, Alan Brewin
