Electronics Forum: casing (Page 176 of 246)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: Marking Codes

Electronics Forum | Tue Jan 05 14:37:18 EST 1999 | Dave f

| I would like to know if it exist a croos reference book for marking code on smt device? | I'm fixing a unit now and try to know what are the following devices: | The look like transistors and are mark like that "8A" |

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon

| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to

Re: Micro-BGA soldering

Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach

| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |

Re: Micro-BGA soldering

Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon

| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02

Re: Defect Rate Measurement Technique

Electronics Forum | Mon Jul 05 18:40:24 EDT 1999 | JohnW

| Dear All, | | We are a medium sized Electronic manufacturing company manufacturing computer motherboards and Telecommunication products. We have a big debate going on within our company regarding the defect rate measurement technique. | | At p

Re: Rework

Electronics Forum | Fri Mar 10 15:47:35 EST 2000 | Casey Scheu

Russ, As I stated earlier 100% satisfaction guaranteed. I'd like to address a couple of your problems. 1. Lack of TC control. I don't really understand this issue. The system is a closed loop system w/ the TC located directly in the nozzle block.

Re: Rework

Electronics Forum | Fri Mar 10 15:47:35 EST 2000 | Casey Scheu

Russ, As I stated earlier 100% satisfaction guaranteed. I'd like to address a couple of your problems. 1. Lack of TC control. I don't really understand this issue. The system is a closed loop system w/ the TC located directly in the nozzle block.

Upside Down Chips

Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef

In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl


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