Electronics Forum | Mon Aug 14 13:08:00 EDT 2023 | dimamalin
Similar issues arose for me in cases where the contact pads of components were located below the solder mask level. Ordering a thinner stencil might potentially solve the problem.
Electronics Forum | Wed Oct 11 05:58:13 EDT 2023 | kojotssss
Hello all, I know there are very skilled guys. Can anyone suggest a stencil design to avoid component displacement during reflow to improve tension of surface forces and selfalignment? There are cases where the inductors are shifted. All parameters
Electronics Forum | Tue Dec 12 04:49:43 EST 2023 | ttheis
Seems like a file was corrupted on the hard drive. Hopefully you have it backed up. We take a hard drive image of every machine on delivery in case of a hard drive failure or corruption.
Electronics Forum | Fri Jan 12 14:05:33 EST 2024 | rygenetic
Hi @calebcSMT, It is generally recommended to avoid coating the entire body of aluminum electrolytic capacitors. These capacitors rely on the venting of gas in case of failure or overvoltage conditions, and coating the entire component could hinder
Electronics Forum | Tue Nov 06 10:40:49 EST 2007 | patrickbruneel
Darby, To my knowledge no case of RoHS (lead) violation has ever gone to court in the EU. The only documented RoHS (lead) violation (again that I�m aware of) has been settled out of court in the UK. Check here: http://www.eetimes.com/news/latest/s
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV
This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s
Electronics Forum | Wed Aug 16 18:03:10 EDT 2000 | John Thorup
Hello CK Do I understand you correctly that you are reflow soldering a copper case containing a previously assembled PCA? Insulation would seem to pose a few problems that would need to be passed on by the design engineer. 1. Keeping the heat of refl
Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV
This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s
Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
