Electronics Forum | Tue Sep 21 14:57:27 EDT 1999 | Carlos Palacios
which is the best way to catch defects online? In circuit Tester or Vision System
Electronics Forum | Sat Mar 04 13:28:53 EST 2017 | ttheis
Could also be the leads catching on the feeder or tray during pick-up. I just had a feeder catching the edge of a lead as the part was picked causing the part to shift and be rejected at severe rates.
Electronics Forum | Wed Sep 22 10:33:17 EDT 1999 | Boca
| which is the best way to catch defects online? | In circuit Tester or Vision System | Carlos, It depends on the defect you're trying to catch. Vision systems can be good at catching missing, reversed, wrong (if marked) parts. ICT is good with el
Electronics Forum | Wed Mar 13 12:02:34 EST 2002 | davef
Did we catch you napping?
Electronics Forum | Wed May 19 16:43:34 EDT 2004 | russ
Wouldn't mind catching a ride
Electronics Forum | Tue Nov 08 16:46:19 EST 2011 | burb1999
Looking for inspection right after the placement machines to catch all that can be caught before reflow.
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Wed Aug 01 10:28:24 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Sat Aug 27 12:10:55 EDT 2011 | kahrpr
Basically it pretty standard to run through the board. For programmers /manufacturing engineers it’s a catch 22. If you check everything management is complaining it takes too long. If you don’t check management is complaining because of rework and y
Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
