Electronics Forum | Sat Jun 27 02:15:33 EDT 2020 | indhu
Hi Victor, The part drop after the first side reflow itself. The part seems like didn't catch solder.
Electronics Forum | Fri Jul 31 19:14:58 EDT 2020 | emeto
Interesting one. I your machine placement algorithm capable to catch missing ball on the BGA while placing? Second question will be about component itself - datasheet will probably help. BGA body amterial? BGA balls alloy? BGA pad material before bal
Electronics Forum | Mon Aug 10 11:51:56 EDT 2020 | spoiltforchoice
Where in the process? Pick and place should know when it drops something and stop. If during reflow you need to work out why something is dropping/being blown off and solve that issue. And the only reliable way of catching that is going to be AOI.
Electronics Forum | Fri Dec 11 17:34:24 EST 2020 | proceng1
You can run it on a carrier board to catch any paste that falls. When we do Pin in Paste, we sometimes over print the apertures a bit to get the extra paste volume.
Electronics Forum | Sat Mar 08 02:43:16 EST 2003 | Frank
We are trying to implement AOI into the mix. One PE wants it Pre-Reflow, to catch and fix the PnP screw ups and the other PE wants it Post-Reflow, because the oven will fix quite a bit of placement offsets and mainly to catch any problems that the R
Electronics Forum | Fri Oct 07 14:37:36 EDT 2005 | jimmyjames
Could I get some help please? I have a Heller 1700EXL, 7 zone oven and I'm trying to figure out a better way of off-loading my completed boards. What I have now is simply a small table at the exit of the oven with about an 8" drop from the top of
Electronics Forum | Mon Jul 20 12:39:11 EDT 2009 | bigdaddysoy9
Hello Reese, Lifted leads are and have always been a big concern for us. We were using a system that had 12 cameras total. 8 angled and 4 top-down. I could not get that to catch lifted leads without having a ton of false calls. I thought that may
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton
I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c
Electronics Forum | Mon Jul 30 05:43:24 EDT 2001 | andy
Hi - I'm looking at 5DX as a method for inspecting BGA joints and would like to hear from anyone with knowledge of this system . Can you tell me how reliable you have found it to be in catching BGA opens ? ...... also any other comments you may have
