Electronics Forum: cb100 (Page 1 of 1)

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef

First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24

Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 12:44:54 EST 2005 | ppwlee

Dave, Do you know if such thermal transfer study with CB-100 (or equivalent) is available for review? My customer is pursuing this option and I am curious on how much improvement I would see by specifying a conductive via fill on the board. Rgds, P

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef

Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du

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