Electronics Forum: ce-1155 and thermal (Page 1 of 9)

Tg and reflow

Electronics Forum | Mon Dec 19 12:21:09 EST 2005 | Amol Kane

from what i know, Tg is important from thermal stresses point of view. board warpage increases greately when Tg is exceed

Td and Tg

Electronics Forum | Wed Aug 27 09:29:10 EDT 2008 | blnorman

I read somewhere there is a thermal measure that takes into account Tg and Td. Offhand I can't remember what it is, does anybody know what I'm talking about?

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu

BGA assembly and inspection

Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung

Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass

Skewed and popped components

Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW

If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap

Nitrogen and dry cabinet

Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal

Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s

Yamaha pick and place

Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob

Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021

We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun

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