Electronics Forum | Fri Jun 29 10:04:27 EDT 2001 | edmentzer
Does anyone know of a company who can repair and straighten the leads on QFP's? We have quite a few parts that were received with bent leads.
Electronics Forum | Fri Jun 29 10:18:24 EDT 2001 | Steve Gregory
Hi Ed! A company that I've used in the past and is very good is Six Sigma in San Jose, California. Their web page is at: http://www.sixsigmaservices.com/ -Steve Gregory-
Electronics Forum | Fri Jun 29 10:19:08 EDT 2001 | Steve Gregory
Hi Ed! A company that I've used in the past and is very good is Six Sigma in San Jose, California. Their web page is at: http://www.sixsigmaservices.com/ -Steve Gregory-
Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman
You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.
Electronics Forum | Tue Jul 03 05:49:24 EDT 2001 | armin
Hi, Anybody could give me the Heat Load of Heller 1800W, Heller 1088 and ICT Tester HP 3070. Read their manuals but could not find the above specs. I need them for our new manufacturing facility / building air conditioning requirement. thanks and r
Electronics Forum | Tue Jul 03 07:02:28 EDT 2001 | Mike
Hi all, I would like to set up specification for inspection adhesive after printing. Does any one has some recommendation, what parameter/criteria should I look for. Thank you.
Electronics Forum | Tue Jul 03 21:16:34 EDT 2001 | davef
No glue on solderable surfaces. Glue is centered between pads. Consider A-610C, "Acceptability Of Electronic Assemblies", para 12.
Electronics Forum | Wed Jul 04 11:07:46 EDT 2001 | a.m.
Hi Mike, What type of component you have the problem? For a quick refernce you have two points for the ideal dot: 1- Dot size = 2/3 of area of glue (pad to pad) 2- Dot height = pad thickness + component stand off
Electronics Forum | Tue Jul 03 09:13:18 EDT 2001 | rstodd
I work for a memory module manufacturer and I am interested in obtaining information on typical first-pass yield numbers and failure rates in the memory module industry for benchmarking purposes. Any information provided would be greatly appreciated
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