Electronics Forum: cfm (Page 2551 of 7890)

thermocouple attachment solder

Electronics Forum | Thu Nov 01 13:02:13 EDT 2007 | slthomas

What are you using? I'm having a tough time finding something I used to use (Kester, seems like it had a liquidus temp. of about 265�).

thermocouple attachment solder

Electronics Forum | Fri Nov 02 11:34:44 EDT 2007 | jdumont

I also use a very high lead content solder for this. Its awful to solder with but works quite well once you have it on...

micropad solder problem ?

Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu

CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.

micropad solder problem ?

Electronics Forum | Tue Nov 06 15:07:43 EST 2007 | russ

Sounds like you did not achieve reflow at all, what max temp did you hit in oven? Russ

Thermal Mass Differences in PCA

Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638

7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.

Thermal Mass Differences in PCA

Electronics Forum | Sat Nov 03 09:42:13 EDT 2007 | davef

There is no such standard, nor should there be. BIG boys [and girls] solder products like this. What temperatures are you measuring on the terminations of these components?

Thermal screening for marginal BGA joints

Electronics Forum | Fri Nov 02 19:02:28 EDT 2007 | yshiau

Hi experts, 1) Do you think a non-operating temperature cycling would do good for screening some marginal BGA joints? 2) If yes, what the exterm temperatures I should go? 3) Any particular profile that is suitable for my need? Thank you!!

Thermal screening for marginal BGA joints

Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree

RF BOARD + SOLDER PASTE TYPE PROBLEM

Electronics Forum | Thu Nov 08 00:10:55 EST 2007 | omidjuve

don`t we have any article about the manufacturing of high frequency board . and precautions that we should use ?

tiny acceleration switch

Electronics Forum | Mon Nov 05 11:50:08 EST 2007 | davef

Low mass accelerometers are very difficult. These type products hold a lot of interest for MEMS companies. Try there.


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