Electronics Forum: cfm (Page 4041 of 7890)

Production Line Setup

Electronics Forum | Wed Jun 19 18:41:52 EDT 2002 | nuezmaster

Our plan right now is only to increase production on the products that we are behind on. Since we are currently running three shifts with seven assembly lines and only adding six people (3-Days, 3-Nights), it averages out to about a 20% increase ove

force between the pad and laminate material

Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao

according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,

Tombstoning

Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi

We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump

Tombstoning

Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno

Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only

Tombstoning

Electronics Forum | Wed Jun 12 18:04:47 EDT 2002 | stownsend

Is this a new problem on an old product, or is this a first run? If this is a new problem on an old product, you may want to check the paste process. If the paste is not even across both pads or is offset a bit, the parts will pop up. If this is a f

Placement machine comparison

Electronics Forum | Wed Jun 12 11:49:32 EDT 2002 | jax

The machines you choose depends on the boards you build and how many of them you build. Assembleon is designed for faster production speeds where Juki is more flexible. Why are you just looking at these two? Aren't they in different leagues? Why not

Placement machine comparison

Electronics Forum | Mon Jun 17 15:25:10 EDT 2002 | lysik

I would look at Universal for sure. They have a ton of late model Chip placer's and GSM's that they will discount heavy. There are so many used GSM's and HSP's on the market you could probably get what you need for a fraction of the cost. You could p

Placement machine comparison

Electronics Forum | Thu Jun 27 02:52:54 EDT 2002 | Darby

Take a peek at a Samsung CP45v before you make a decision. I'm running two before a CP40v. Runs very well. Clever software. Cheap. I'm also running two Tenryu/i-Pulse FV-7100 in line vintage 1999. Great machines but it may be some time before the sup

Solder Splatter

Electronics Forum | Mon Jun 17 21:20:48 EDT 2002 | davef

Consider slowing down the rate of heating during reflow to eliminate the ejactula. Well, if you feel this is caused by your customer�s design, it is repeatable, you think it�s coming from the reflow process, and you think your reflow process is well

NEPCON - not what I expected

Electronics Forum | Thu Jun 13 15:43:19 EDT 2002 | mjabure

The major draw at NEPCON was the the machine manufacturers. With most of the big players going to the APEX shows, NEPCON attendance has seemed to slow down quite a bit. Although APEX wasn't very busy either. With the industry in it's current state no


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