Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Wed Oct 12 12:33:11 EDT 2005 | Inds
Hi Everyone, I am trying to site dress PTH holes filled with Nihon solder mixed with SAC solder at the rework station. But what i am seeing is the solder just doesn't melt and I am not able to suck the solder out of the PTH. Has anyone faced this i
Electronics Forum | Wed Oct 12 13:53:03 EDT 2005 | russ
What is nihon solder and which SAC alloy? Try using hot air to preheat the board to about 150C if you can, then try to remove the solder. Sucking pbfree from holes is very difficult since you have to achieve the alloys melting point throughout the
Electronics Forum | Wed Oct 12 14:13:08 EDT 2005 | Inds
SN100C is the Nihon solder. I had wave solder the board using SAC. Then had to put on solder pot, which had SN100C (nihon) solder. I think I went upto 130-135 deg C.. Let me try cooking it to 150degC Thanks
Electronics Forum | Thu Oct 20 23:01:12 EDT 2005 | davef
A highly activated flux will allow intermetallics to form, because the hydrogen halide gas that formes at operating temperature will react with the refractory nickel oxide. Refractory nickel oxide is what makes SS "stainless". This will be worse wit
Electronics Forum | Thu Oct 13 10:51:26 EDT 2005 | djshure
Hello. I'm wondering if anyone out there is working with prototyping 201 sized componants. I'm curious to know about the tools you like to use. I am quite comfortable placing 402's alld ay long with a simple soldering iron, but i'm concerned that i w
Electronics Forum | Fri Oct 14 14:00:35 EDT 2005 | patrickbruneel
Mika, If I understand you correctly you compare hole fill of Ni/Au plated boards in a lead-free process with HASL 63/37 boards soldered with leaded solder. If this is the case you might be facing the challenges in Pb free wave soldering with the lim
Electronics Forum | Tue Oct 18 00:31:17 EDT 2005 | KEN
I suspect the problem is a surfactant issue in your flux. I have seen where boards are fluxed, hit the solder fountain and come out like they never touched the solder. There was an inadequate surfactant between the solder and the PCB. I know you
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
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