Electronics Forum: cfm (Page 4541 of 7890)

RoHS Tool kits

Electronics Forum | Wed Nov 14 20:06:20 EST 2007 | petep

I would like a nicely packaged set of assembly tools (green handles and pouch) for use with RoHS assemblies. I have Green mats, dedicated irons, but would like clearly identifiable tools to better segregate the process. Can any of you provide a Man

question for Fuji Flexa

Electronics Forum | Thu Nov 15 03:13:08 EST 2007 | duyhoang

Dear all, I want to use fuji flexa software to connect to FIP2 (ROM version 1.82). Does anyone help me to connect it? Do I have to upgrade version of FIP2? Which steps do I have to do to use flexa for FIP2? If it needs to upgrade a higher ROm versio

High Temperature PCB ink

Electronics Forum | Thu Nov 15 10:33:35 EST 2007 | paulallan

Does any one know of a supplier high temperature PCB ink that can safely used between pads on an SMT connector. The product ideally should be screened on and have resistant to short exposure to heat from a selective lazer. Must be non-conductive and

Resonator Cracking

Electronics Forum | Sat Nov 17 18:16:46 EST 2007 | jwsmt

You mention moisture in the part as a cause of cracking during reflow. What does this type of crack look like? How was it determined that moisture was the culprit? The resonator is near the middle of the PCB, but is about 5mm from a large hole (abo

RoHS PCB Questions

Electronics Forum | Fri Nov 16 08:46:30 EST 2007 | jdengler

For very simple boards, 2 layers lightly populated with light thermal mass, we still use FR4. For most of our Pb-Free boards we use the higher Tg material with moisture-resistant packaging. We are a CM so we don't usually get to change many of the

JUKI vs I-PULSE vs MYDATA

Electronics Forum | Fri Nov 23 18:17:31 EST 2007 | SMT

Always base your decision based on the need, rather than mearly comparing the specificaiton. The specifications are only indicator and not true performance for a specific application. Mydata and their agilis are good for high mix medium volume produc

Epoxy application

Electronics Forum | Wed Nov 28 07:41:10 EST 2007 | davef

DevGru: Questions are: * What steps do you recommend taking to "watch out for the exothermic heat from the curing?" * What are typical temperatures for exothermic heat from the curing? * What is the duration of such temperatures? * Do epoxy suppliers

Epoxy application

Electronics Forum | Thu Nov 29 21:28:43 EST 2007 | hussman

Henkel Loctite makes a hot melt just for this. Do a web search on Loctite Hot Melt and you can see for yourself. Material comes in a variety of ways - we use the 10 inch sticks and their glue guns specially made for the material. Works well, is fa

Epoxy application

Electronics Forum | Fri Nov 30 15:23:03 EST 2007 | jdumont

The hot melt is prob the only way to go for that size gap. If you could decrease that gap I would suggest using 3M Scotchweld DP100FR. Check it out. We use the duo pak cartridges and mix nozzles with the gun. Very simple use and works great in our ES

Ruggedized PCB Assembly

Electronics Forum | Wed Nov 21 16:56:46 EST 2007 | pms

Thanks folks, Yes, we do not have enough info yet to make decisions at this point. Just trying to get a feel what folks would do in this case. Enig,Black-Pad-Nickle skips....Always concerned about ENIG. Silver finish? Is this better? DaveF, Thank


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