Electronics Forum | Thu Jul 20 13:15:13 EDT 2000 | Bob Willis
I don�t think you are correct in the case that the legislation has been adopted only the proposed legislation has had the date changed. The main driving force seems to be commercial, making sure that if one company dumps and provides a lead free pro
Electronics Forum | Thu Jul 20 14:36:57 EDT 2000 | Bob Willis
Yes there will be higher process temperatures on the currently preferred alloys of tin/silver. There are not that many companies highlighting they have the solutions although many parts will be fine. If all components meet the requirements of the IP
Electronics Forum | Thu Jul 20 12:30:29 EDT 2000 | Bob Willis
Personally I would go for one alloy it just makes it all simple to control. I have only used tin/silver and tin/copper so far with good process results. Reflow is relatively straightforward, I have had more shorts with wave on tin/copper. To date I
Electronics Forum | Thu Jul 20 12:19:24 EDT 2000 | Dave F
Bob: Techniques for removing RFI / RF shields vary according to the size and type of shield. Removing: * PTH RFI / RF shields is as straight forward as the next heat sinking PTH component, often using a solder bath or fountain. * Small SMT RFI /
Electronics Forum | Thu Jul 20 12:18:02 EDT 2000 | Dave F
Bob: We are trying to improve the decision making process used by our Material Review Board (MRB). We have a fairly standard defect identification and MRB process. In this we: * Identify problems in components and assemblies. * Segregate problems
Electronics Forum | Thu Jul 20 16:50:50 EDT 2000 | Bob Willis
Again it�s a good question but I don�t think I have any thing to offer. I have always been of the opinion that nearly any problem can be reworked. Many problems do not make cost effective but that is not always the issue. When a machine is down, a
Electronics Forum | Thu Jul 20 12:16:26 EDT 2000 | Dave F
Bob: On "paste push-out" (when inserting a component lead into a through hole pushes the paste out of the hole) in pin & paste assembly: * What factors affect paste push-out? * What techniques reduce this effect, given a board design and component
Electronics Forum | Thu Jul 20 16:33:13 EDT 2000 | Bill Brooks
Hi Bob, I am a member of the IPC Designer's Council and as the Education officer for our San Diego Chapter, I would like to see more information available to help educate the existing Designers and the students in design classes we are trying to ge
Electronics Forum | Thu Jul 20 16:39:21 EDT 2000 | Bob Willis
There are so many people with this knowlege I would suggest some form of evening class. We did use to do it over here but it did not have many takers. I lecture every year at two universities and schools its great fun and don't you people ask the mo
Electronics Forum | Thu Jun 22 17:17:27 EDT 2000 | Bill Schreiber
The U.S. Environmental Protection Agency (EPA) has finally taken a progressive position by creating the Environmental Technology Verification (ETV) Program to verifiy the environmental safety, user safety and efficacy of products prior to their purch
