Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
Electronics Forum | Thu Jul 12 10:45:42 EDT 2001 | Hussman
Since your customer is complaining, you'd better be pro-active. Doesn't mean they're right, but without customers, life sux alittle. Anyway, ask them for a profile of the 5 reflow processes. If they don't have that and you have a profiler, ask if
Electronics Forum | Fri Jul 13 01:34:13 EDT 2001 | dlkearns1
Quick update on my issue of " wicking ". I had some talk with the company QA guy. Told him I saw no wicking on the test panels at 30X. The next day he came up to me and said, he kinda saw a little something at 60X then verified that at 100X, So, he
Electronics Forum | Mon Jul 16 08:56:56 EDT 2001 | Hussman
Easy, DL says the customer is telling him after 5 reflow processes they get solder under the mask. He tried it and didn't see anything. DL needs more information to understand why and where this is occurring. So, if he can't duplicate the problem
Electronics Forum | Mon Jul 16 22:40:02 EDT 2001 | davef
Speaking of people we'd like to pimp slap, why did the not-so-quality guy decide to ship defective units, anywho? This sorta says we can't blame the customer any longer. So, it's either blame the fabricator or umm er, sorry to say this ... YOU DL,
Electronics Forum | Sat Jul 07 08:19:47 EDT 2001 | Stefan Witte
If your pads are raised as you mentioned, you will reach just the tip of your tiny glue dot, which may not hold the part in place. However, you should be using two glue dots on each side of your 0402 component. See under adherence force in paste a
Electronics Forum | Wed Jul 11 14:08:21 EDT 2001 | markhoch
Are you guys providing adequate board support during glue dispense and placement? I've had this same problem with 0603's that I was able to correct with adequate board support. Also, if you're using a Fuji glue machine, what are your temperature sett
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