Electronics Forum: cfm (Page 5666 of 7890)

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron

Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 10:55:37 EDT 2005 | patrickbruneel

Hi Joseph, It's difficult to troubleshoot if the defect is unknown, but I agree with Chris The majority of components are already lead-free and only 17% of the worldwide electronics industry switched to lead-free wave and/or paste so the majority o

SPM AV Different Problem

Electronics Forum | Wed Jun 08 12:04:34 EDT 2005 | james

Ok here I go again. I got rid of the last problem but now I am back to a different problem. When the machine sits and I press Reset, the screen reads Starting the Z-axis Homing the Programmable squeeges and just stays there and does nothing. So I E-s

SPM AV Different Problem

Electronics Forum | Wed Jun 08 13:16:02 EDT 2005 | cyber_wolf

It sounds to me like it may be your squeegee Z motion controller card. The SQUEEGEE Z motion controller card is interchangeable with some of the other motion cards in the back of the machine.(NOT ALL OF THEM) Make sure you look at the power ratings a

Solder Paste Flux %

Electronics Forum | Sun Jun 12 08:37:20 EDT 2005 | davef

Paramjeet Singh Gill Flip chip with aqueous flux, that's interesting. * What is the stand-off from the board is your flip chip? * What machinery and materials do you use clean your boards? * How do determine the cleanliness of the board under the fl

Solder Paste Flux %

Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie

I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul

Stencil thickness

Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton

If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.

HOW TO REDUCE MACHINE SET-UP TIME???

Electronics Forum | Thu Jun 09 08:37:49 EDT 2005 | james

Just wondering if anyone else out there has been able to reduce Set-up time on SMT Machines. We are a contract manufacturer and run several different models in one day on 4 different machines. We currently have 40-50% downtime due to set-up time.

HOW TO REDUCE MACHINE SET-UP TIME???

Electronics Forum | Thu Jun 09 08:59:46 EDT 2005 | nice90

when we run a pilot run it usually takes a lot of time because it needs to be properly adjusted so that on production time everything could be set up easily and run smoothly. on a no feeder situation, components for the next model should be already l

HOW TO REDUCE MACHINE SET-UP TIME???

Electronics Forum | Thu Jun 09 15:56:19 EDT 2005 | james

I would love to buy enough feeders, just for the common parts but unless I find somewhere cheap to buy them it can very expensive. We use our own internal part numbers with using smart feeding stations. Also we are going to try to leave all the comm


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