Electronics Forum | Mon Oct 03 21:15:16 EDT 2005 | adlsmt
Its a single board, one up. 4 layer, pretty simple, no large copper pours. We get these consigned from our customer so I cant work that end of it but wanted to make sure to cover everything I can. The oven it runs in was just checked out by the facto
Electronics Forum | Mon Oct 03 22:12:53 EDT 2005 | davef
When we see warp and twist, we usually jump the fabricator for: * MLB construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selection (usually cheap and dirty), etc. War
Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
Electronics Forum | Sat Oct 01 11:48:45 EDT 2005 | Hiram
Hello everybody, We are in the process of implementing NC process on the wave solder. We have a Sonotek XL fluxing system. Any ideas out there? Solder used: SN100C Flux options so far: 264-5 flux, 270WR VOC-free 9both from AIM solder) The flux ch
Electronics Forum | Mon Oct 03 09:24:38 EDT 2005 | John S.
We are implementing a high volume dedicated product line that will be doing lead free selective soldering. There seems to be 3 basic technologies. Wire fed (Panasonic Softbeam or Laser), solder pumps and chimneys (Pillarhouse, SEHO, ERSA, etc) and
Electronics Forum | Mon Oct 03 09:31:31 EDT 2005 | Rob
There's also microflame which uses a mini gas flame to melt the solder. We tried a number of ways then modified some conveyorised robot cells we bought at auction, using wire feed & an iron head, incorporating veriable tinning & preheat, with point
Electronics Forum | Mon Oct 03 12:22:54 EDT 2005 | Stew
Depending on your application, you may need to pre-heat before Soft Beam (unless they make one for it now). Plus, very small connections seem to push it's limits. The beam can only get so narrow. Lasers are good but reflectivity can come into play
Electronics Forum | Mon Oct 03 12:11:18 EDT 2005 | PWH
Soon we will be manufacturing board assemblies on our SMT lines that will utilize both lead and lead free water soluable solder pastes. I have read some discussion about change-over from lead to lead-free jobs related to machine cleanliness, etc. H
Electronics Forum | Fri Oct 07 09:18:39 EDT 2005 | russ
If you're using non-lead free parts then you don't have a pbfree assembly so why worry about marking it anyway? We apply this artwork after the assembly has been completely engineered for lead free. Artwork can be covered up with mask or whatever if
Electronics Forum | Wed Oct 05 15:03:40 EDT 2005 | Amol
depends on what you want evaluated! you can thermal cycle the BGAs and the examine the x-sections to determine failure modes at different stages of thermal cycles. you can do a stress test and corelate the # of thermal cycles with the microstructu
