Electronics Forum | Thu Mar 18 12:46:20 EDT 2010 | deanm
The standard J-STD-033B.1 addresses how to store moisture sensitive components. A dry box is a good, convenient way to store MSDs, but there are other methods to consider which are outlined in the standard. Are you sure that the problems are caused
Electronics Forum | Mon Mar 22 07:40:01 EDT 2010 | emanuel
Are you absolutely sure the problem is with the humidity? We had a problem with 3528 size leds, damaged by the pick and place nozzle because a 0.2mm mistake in the height measurement. Also, we found that several suppliers are using fake desiccant ba
Electronics Forum | Mon Mar 22 10:24:14 EDT 2010 | mun4o
Hi , I think that our problem is humidity, because when I use leds from new tape ( pack in MBB ) no any defects.After that, we put opened tape in our store.After 2-3 weeks I use the same tape with leds, and we have 2-3% defective leds.I make this tes
Electronics Forum | Tue Mar 23 03:42:51 EDT 2010 | grahamcooper22
Hi, It is very important to follow IPC JEDEC 33 specification for storage and handing of all MSDs. In many instances defects caused by excess moisture in packages is not immediately evident (pcbs may pass final test) but when pcb has been in the fiel
Electronics Forum | Fri Mar 19 12:53:35 EDT 2010 | pcbrookie
Hello everyone. I'm looking for some general information on reel counters. We are trying to tighten our inventory counts, and rather than estimate a reel we're looking into getting an accurate count via a reel counter. So first, I'm wondering what
Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
Electronics Forum | Fri Mar 26 00:57:05 EDT 2010 | 89jeong
Hello Sir. We also have faced a same problem. At that time, we had to repair it because we could not find any solution. But in our experience, the void underneath FET was more severe whenever we used the FET that have been made long time ago. It is
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
