Electronics Forum | Fri Jun 26 08:00:45 EDT 1998 | John Klimek
I have a used Hollis machine that might suit your needs. The only problem is that it is an oil blanketed machine. It is a 7" Hollis Nova 175. Right now it is collecting dust. | | | | | | | | | | Is anyone aware of any papers/publications dealing
Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Thu Jun 25 21:13:11 EDT 1998 | Phillip Hunter
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Print speed is determined by your aperture dimensions, paste viscosity type of blade (metal
Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Thu Jun 25 12:45:37 EDT 1998 | Steve Gregory
Hi there Chris! Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the locations wh
Electronics Forum | Thu Jun 25 11:47:39 EDT 1998 | Steve A
| Hi there, | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | Appreciated for your help. | rgs, | chiakl Chiakl, It looks like you are speaking of what could
Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis
Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu
Electronics Forum | Wed Jun 24 16:30:37 EDT 1998 | Justin Medernach
Hi all, I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process terminolog
Electronics Forum | Wed Jun 24 20:06:42 EDT 1998 | Dave F
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach
| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te
