Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Wed Sep 08 17:49:19 EDT 2004 | gregoryyork
Knock off some balls and you may find it has a flat bottom to it were it has mechanically stuck to the solder resist usually seen under 60X magnification. Common with Liquid photoimageable resist (I know again) Best way to check resist cure is to pay
Electronics Forum | Wed Sep 08 15:59:25 EDT 2004 | kbayram
Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although I'm worried about the placement accuracy and repeatabi
Electronics Forum | Tue Sep 14 04:42:58 EDT 2004 | rlackey
Hello again Mr Bayram, You will need to do certain tasks to schedule - things like lubrication etc, but these are very simple tasks. But yes, if you are running a lot slower then the major service tasks will be less frequent. One thing I ought t
Electronics Forum | Thu Sep 09 03:57:45 EDT 2004 | svi
Hello, We used FujiCAM to prepare FCM programs but now we're thinking to change it to an other software. We have some FCM and some (more) FUJI machines also. We used FujiCAM to controll and proram the lines but we changed it to Fuji FlexA. Microsof
Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Tue Sep 14 18:27:37 EDT 2004 | MikeF
I would need a little more information to be able to rule out some of the possible causes. Have you checked to see if the pins with the minimal solder have anything in common, do all have traces to them? or internal power or ground plane connections?
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Tue Sep 14 08:46:31 EDT 2004 | scombs
I'm currently working for a OEM that has 700+ stencils in house and we received 30 to 40 stencil a month. We recently switched to a no clean process which is causing the stencil part numbers to disappear from the stencil frames due to the saponifier
Electronics Forum | Tue Sep 14 14:25:35 EDT 2004 | scombs
Thanks everyone for all the input. All of our stencils do have the PCB # etched on the foil but when operators look for the stencils they are looking for the part # on the frame since they are all stored vertically in a couple of Remstar shuttles and
