Electronics Forum | Thu Dec 07 12:29:57 EST 2006 | fastek
It makes sense if you think about it. Siemens was a dead company ready to fold up their tents back in the 80's and early 90's. To their credit they stuck to their platform...got somewhat lucky and the market sort of came to them as the wave of users
Electronics Forum | Fri Dec 08 14:54:06 EST 2006 | Terry
Siemens is the General Electric of Europe. Like GE, Siemens typically is in the top 3 positions ($ market share and profit) or they exit the business. In total revenue I expect Siemens to be in the top 2-3 globally. In units I expect Yamaha has the
Electronics Forum | Mon Dec 04 12:35:11 EST 2006 | Rob
Hi AJ, Issues we have seen: Test houses not explaining results adequately/customers with their own XRF equipment not sure what they are looking for, resulting in lots of goods in rejections/requests to return stock mostly centered around: 1) Lead
Electronics Forum | Mon Dec 04 11:46:41 EST 2006 | samir
SMTNetters, I have a product coming down the pipeline that we'd like to make pure double sided reflow, it'll be RoHS product, and the hope is... we'll be able to solder the thru-hole stuff by screen printing solder paste and reflow soldering. Anybo
Electronics Forum | Tue Dec 05 15:40:05 EST 2006 | jdengler
What year is your machine and what year is your Electric Drawing? My machine is 1989 and so is my drawing. I do not have a SIP-1750 drawing. The IP went through several changes during its production so your machine may not match mine. The CON I/F
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef
It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w
Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim
As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with
Electronics Forum | Thu Dec 07 11:49:28 EST 2006 | K
We currently have RMA and WS soldering processes here and do batch cleaning for both. We are experiencing some capacity issues and are interested in looking at an IN-LINE aqueous wash. My experience with in-line wash is only with WS. 1. Since RMAs
Electronics Forum | Thu Dec 07 13:51:59 EST 2006 | ganoi
I need advices as to how a gap between the bottom of an LED (1209-package) and the PCB can be controlled on a small rigid-flex PCBA? The problem that we experience is due to tight tolerance in the design of our molded housing in which this PCBA is as
