Electronics Forum | Tue May 25 11:31:57 EDT 1999 | Scott Cook
| | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing
Electronics Forum | Tue May 25 12:19:55 EDT 1999 | M Cox
| | | | | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, bl
Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings
I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!
Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur
John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai
Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F
| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Thu May 20 03:22:21 EDT 1999 | Earl Moon
| Hello everbody! | | I was wondering if any of you have any GOOD recomendations of WEB sites to post one's resume? I've sent my resume here of course, but am looking for others as well... | | I've already been to www.monster.com, www.assemblyNet.c
Electronics Forum | Thu May 20 18:08:57 EDT 1999 | DEON NUNGARAY
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | Deon Response:|
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is