Electronics Forum: chamber and hood (Page 1 of 1)

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

Cure Ovens and Cycle Interuption

Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris

I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ

Re: No clean and f devices

Electronics Forum | Fri Nov 12 10:40:17 EST 1999 | Dave F

Some under-the-hood automotive people have moved from no-clean to clean, and I mean CLEAN, recently. Hmmmm Dave F

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Inline Aqueous Wash for WS and RMA fluxes

Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad

Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but

Possibility of a cheaper pick and place machine design?

Electronics Forum | Fri Jul 04 19:17:37 EDT 2014 | andrespena

Hi (I don't know if this forum is the best place to post something like this, but I don't know of other places on the internet, so... sorry if I'm in the wrong place) Might there be an easier way to add components (e.g. computer chips) to a circuit

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