Electronics Forum: chambers (Page 11 of 22)

dry oven

Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech

Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm

Parylene Coated BGA Rework

Electronics Forum | Thu Apr 10 17:44:22 EDT 2003 | davef

Q1: Can they be masked so parylene doesn't get underneath? A1: Your parylene applyer may be able to mask area, but in general no. This stuff is cured in a vacuum chamber to make sure that it gets into every past corner. Q2: How do you remove and re

Nitrogen Reflow Oven

Electronics Forum | Sun Apr 04 15:33:01 EDT 2004 | Jimmy

We are looking at several reflow ovens with intent to acquire one for both air and nitrogen reflow capability (i.e. have the capability to reflow in either air or nitrogen environment). Would be interested to know what I should look for in comparing

epoxy for other than water tight seals

Electronics Forum | Thu Aug 05 10:38:49 EDT 2004 | iggyslab

Is there a specific epoxy that is most suitable for sealing a polycarbonate chamber, which will have hydrogen flowing through it at no greater than 10psi? Can any epoxy that provides a watertight seal be used for hydrogen applications? We have th

Thermal cycling equipments

Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe

FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p

caps moving from pads

Electronics Forum | Wed Sep 21 18:09:03 EDT 2005 | PWH

We've had parts jump off pads on occasion due to panels or boards that are restricted in a carrier during reflow. The boards/panels expand and the restriction causes them to warp thus popping parts around during cool down. Doesn't sound like your p

Internal Oven Calibration

Electronics Forum | Mon Feb 13 13:19:35 EST 2006 | pjc

ECD's OvenRIDER is the only instrument I know that can measure thermal transfer efficiency of a an oven. I suppose it would work for environmental chambers too. This instrument has thermocouples to measure ambient temp of oven zones and well as hi-ma

Vacuum Bags

Electronics Forum | Wed May 16 13:40:19 EDT 2007 | slthomas

"I read a study a while back by IBM that showed too strong a vacuum would cause too much moisture to enter the bags." That's what the nitrogen is for. If you pull a vacuum w/o backfilling with something dry, like nitrogen, pretty soon the vacuum ove

Flux Residue on Heller MKIII

Electronics Forum | Fri Sep 07 09:13:21 EDT 2007 | smtirl

Folks, we've recently upgraded to Heller MKIII reflow ovens with Gen 9 cooling units. We're running N2 atmosphere at 1000ppm O2 and Kester256 solder paste. We're seeing a big problem with flux residues building up in the cooling section of the

Thermal screening for marginal BGA joints

Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau

Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe


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