Electronics Forum | Fri Nov 01 08:39:43 EDT 2019 | johnce
At this point, I do not plan to back-fill with nitrogen. I have confirmed that vacuum baking, with the temperature set to 40°C, will result in the chamber %RH being less than 5%.
Electronics Forum | Mon Apr 11 16:12:15 EDT 2022 | glasscake
MC Master has something similar but you pressurize the chamber with a nipple then have the unit disconnected from air.
Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP
Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Wed Feb 17 11:31:37 EST 1999 | Bill Schreiber
Dear Al, Are these reworked, double-sided boards? If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if this is a s
Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Sat Nov 05 07:17:25 EST 2005 | JeffP
That was the case with your oven but it is not so with ours. First, the distance from walls of the inner chamber to the product differs from one oven to another. Second, the dissipation of heat from metal heats up the air in the oven which in turn h
Electronics Forum | Mon Apr 28 19:50:09 EDT 2008 | boardhouse
My guess is that either the board house did not cool the boards down properly coming out of the lamination oven. Typically after they come out of the heat chambers they go into a cool down chamber for x amount of time, if they cool to fast or are pu
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