Electronics Forum | Tue Apr 25 01:23:28 EDT 2006 | kanna
Thanks. currently we already reduce the temperature and change the bimetallic switch. can anyone help me on the alert problem. the alert trigger when the zone 1 section empty without board. current temperature setting is 187 even i lower the tem or i
Electronics Forum | Mon Sep 26 14:09:08 EDT 2005 | slthomas
"Note: nothing changed to the process, the problem come out of sudden." Did this happen with a batch of boards you'd been running a while, or was it a new batch (lot/date code)of boards? I'd be inclined to suggest that the environment that your my
Electronics Forum | Thu Oct 06 21:32:37 EDT 2005 | Ken
Exactly. Also consider how customers are begining to dabble in LF and want to use the same FABS for concurrent builds. The don't want to add or modify any PCB artwork and pay for NRE changes. And they don't want to keep two part numbers for the sa
Electronics Forum | Tue Oct 11 18:21:36 EDT 2005 | stepheniii
Does it do nozzle changes at a different speed than the programs? It's been a while since I worked on these beasts. I"m wondering if it can handle slow speeds but at full bore it can't handle it. Maybe try one part with everything set to slow speed
Electronics Forum | Fri Oct 14 15:55:16 EDT 2005 | nuezmaster
Thanks Rob, I have samples and production quantities that we are running on leaded assemblies now. I guess my next question would be, if you are already building lead-free assemblies, how are you processing the electrolity and tantalum caps? The o
Electronics Forum | Fri Oct 21 08:55:38 EDT 2005 | aj
All, I have been asked to review how we come up with costing of products. Basically, can anyone share how they do this i.e. If the machine can run 60 boards per hour what is a fair allowance for reel changes etc. I am guessing 15% . Any help/ad
Electronics Forum | Wed Oct 26 03:43:11 EDT 2005 | meritajs
Hi Ken, Thank for your advice We suppose that with home position all is OK and ratio is in interval 40-60%.Y axis offset is not constant 5mm or 10mm but change ratio with working time and may be more than 10mm We think that problem is with Yservo mo
Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev
Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Mon Nov 14 17:09:07 EST 2005 | davef
From Alpha Metals: "The test for copper dissolution was conducted by dipping a pre-fluxed copper wire specimen into the test alloys for a specified time period. The change in diameter of the copper wire is measured and a rate of erosion is determined
