Electronics Forum: change (Page 366 of 516)

Alum Electrolytic Caps

Electronics Forum | Mon Oct 17 05:35:00 EDT 2005 | Rob

Hi Harrit, We are processing SMT eleco's normally - up to around 8mm in height, the larger sizes can still be avoided and are through hole as the cost of them outweigh the benefit of surface mounting them (although we did get good results on test fo

Reflow Ovens

Electronics Forum | Tue Oct 18 06:04:39 EDT 2005 | Rob

It depends on a number of factors - including as Russ pointed out, complexity (sometimes you need to create very complex profiles if you have large BGAs and other such components, which require at least 7 heated zones), then you have size, required l

Machine capability studies

Electronics Forum | Tue Oct 18 04:44:44 EDT 2005 | dougs

these are two separate things, your MSA is measurement systems analysis, moving a machine won't change the way you measure your machines performance so you don't need to do MSA again. you should check machine capability once a machine is moved thoug

Etchback

Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef

When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control

Cycle Time Estimates

Electronics Forum | Fri Oct 21 09:13:50 EDT 2005 | rlackey

Hi AJ, Depends on what machines you are running, how you run them, and if you have the spare components on feeders lined up ready to go. On a volume job using CP's using both feeder banks on change over I'd be upset if they stopped for more than a

V-score cracking components

Electronics Forum | Tue Nov 15 08:41:04 EST 2005 | Joe Wesley

Since I asked the question - here is what we have identified. We are doing what we call a jump score. Routing critical areas with v-score in non-critical areas. We have optimized the v-score depth as much as we can without having separation through h

RoHS parts - leaded solder

Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel

Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint

Need Advice on SMT Pick&Place Machines

Electronics Forum | Thu Nov 24 01:45:44 EST 2005 | pavel_murtishev

Good morning, My advice is to put two Topaz-Xii in line. Machine programming is rather easy (with PPS and GPP that AssemleOn offers), but final teaching on machine is strongly required. If you want to prepare programs fully offline you�ll have to pu

HELP ON SANYO TCM-V822 HIGH SPEED MOUNTER

Electronics Forum | Thu Nov 24 04:21:02 EST 2005 | Twistie Ng

NEED EXPERTISE HELP / SOLUTION for Sanyo TCM-V822 High Speed Mounter. Errors Message Code : REEL TIMING 01 18 & REEL SERVO 01 01 ============================================================ This unit has yet to run since our purchase a month ago.

Solder wetting issues

Electronics Forum | Wed Dec 07 14:55:14 EST 2005 | Samir Nagaheenanajar

Here in Rihad, I am in the midst of Pb-Free implementation, and most of our paste manufacturers have advised that with the higher peak temperatures, you need to retain the activators as long as possible. I have changed our profiles to a more gradual


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