Electronics Forum: change (Page 476 of 516)

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:06:01 EDT 1999 | Jagman

| | | | A potential customer of our is inquiring if we have capability | | | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | | | | | One

Re: Process Change

Electronics Forum | Sun Jun 06 02:04:01 EDT 1999 | Steve Gregory

Hi Ryan! First off, who's telling you you need to do things bass-ackwards from what a normal process dictates? The x-ray vendor, or someone within your company? The only reason that I can think of to do something like that is because that decoupling

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: QFP solder paste volume

Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW

| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor

Re: Radial capacitors have water gain

Electronics Forum | Tue May 11 00:47:59 EDT 1999 | P.L. Sorenson - Technical Consultant

| | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnigh

Re: Radial capacitors have water gain

Electronics Forum | Tue May 11 06:30:41 EDT 1999 | Joe Byrde

| | | | | | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This

Re: BGA ball size reliability

Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff

| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Fri May 07 02:29:16 EDT 1999 | Bob Willis

| | I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | | | PROBLEMS | | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometim

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW

| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi


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