Electronics Forum: changes (Page 421 of 516)

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: No clean solder paste

Electronics Forum | Tue Jul 06 10:12:44 EDT 1999 | John Thorup

| | Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | | | John, | | No clean is as good as your process, and the paste you are using. Everything I do is no cle

Re: product changeovers

Electronics Forum | Fri Jul 02 07:55:52 EDT 1999 | Earl Moon

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c

Re: product changeovers

Electronics Forum | Fri Jul 02 14:32:44 EDT 1999 | Dave F

| I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/change

Re: product changeovers

Electronics Forum | Fri Jul 02 16:16:53 EDT 1999 | Scotty

| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan

Re: Wave solder edge covers

Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony

| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side

Re: problem when testing the RF product

Electronics Forum | Wed Jun 23 16:54:16 EDT 1999 | Frank Frimpong

| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 13:43:17 EDT 1999 | Earl Moon

| | A potential customer of our is inquiring if we have capability | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | One of the earlier u

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 13:58:34 EDT 1999 | John Thorup

| | | A potential customer of our is inquiring if we have capability | | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | | | One of the e

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:01:44 EDT 1999 | Jagman

| | | A potential customer of our is inquiring if we have capability | | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | | | One of the e


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