Electronics Forum | Fri Jul 14 17:32:36 EDT 2023 | ttheis
Having an issue with changing nozzles on one of our FJ3 heads. We get errors on spindle 5 and 6 when bank-changing nozzles. Event code 31208, unable to find any info on this code. When we use the put nozzles away routine it does it no problem but has
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
Electronics Forum | Tue Oct 03 15:27:37 EDT 2000 | Wolfgang Busko
What�s wrong with your printing process and what improvement do you expect from dispensing ? I can imagine that it�s more convinient just to have this process inline, no worrying about stencils, cleaning, changing printer setting, just replacing a ca
Electronics Forum | Wed Aug 30 23:45:28 EDT 2000 | Ramon I Garcia C
Hi friends; Steve I'm using flux Kester 959, my top temperature is 187 celcius degrees, my e-mail is ramigary@smtnet.com, Travis I'll check the pcb for contamination, but how may I clean the pcb? may I use alcohol? Nance I cleaned the pipes of the
Electronics Forum | Tue Jul 25 16:23:33 EDT 2000 | Paul Wright
Vicki, Ask your CAD guys to give you the centroid X-Y data with reference designators in ASCII format. Then import that file into Excel. You can then change the fields and data into the format you need. Make sure you left justify the columns. Af
Electronics Forum | Thu May 18 13:08:33 EDT 2000 | Wolfgang Busko
Chris, one question, which standard allows to put it in the drawings/dokumention? As I said in my old IPC-D-275 it says "no". Did it change with the new edition ? Referring to J-STD-001 in this case seems to me like "I followed only the orders and do
Electronics Forum | Wed Apr 12 21:33:27 EDT 2000 | Micah Newcomb
Billy and Chris have a good point, pad size and geometry will affect proper aperture size and geometry and could result in tombstoning. Also I have seen chips which require special pastes but I have never found this to be the cause of tombstoning, in
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
Electronics Forum | Tue Jan 30 14:59:07 EST 2001 | MikeF
I thought Contact Length refered to the travel distance the board stays in contact with the solder. I measured it using a tempered glass plate that also showed me if I had an even footprint of contact with the wave. By this definition, conveyor spe
