Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko
Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to
Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
Electronics Forum | Wed Apr 11 06:56:20 EDT 2001 | brownsj
Most of the component vendors I've dealt with will guarantee the solderability of the terminations for three years if the components are still packaged in a full reel. If the reel is part used we've kept them for 1 year and then used a wetting balanc
Electronics Forum | Wed Apr 11 06:56:46 EDT 2001 | brownsj
Most of the component vendors I've dealt with will guarantee the solderability of the terminations for three years if the components are still packaged in a full reel. If the reel is part used we've kept them for 1 year and then used a wetting balanc
Electronics Forum | Wed Jun 06 15:23:36 EDT 2001 | blnorman
We do it because we have had problems in the past. We accept the viscosity certs sent from the vendor, but we run a check on a sample sent in. We have had problems in the past with material sent from the factory sitting on a loading dock or somewhe
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Mon Jul 16 21:44:07 EDT 2001 | davef
You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PRO
Electronics Forum | Fri Jan 28 06:01:13 EST 2000 | k.s park
HI. Mr. Dave F First of all I appreciate your advise. Here is the answer to the question you sent. I was considering the solder inspection m/c for a long time. so i bought the LSM2 last year.i thinks it was good for me. further more Last year
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
