Electronics Forum: check (Page 446 of 631)

Solder Balls

Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw

shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf

soldering issues

Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef

Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board

Unicam/fujicam

Electronics Forum | Fri Jun 21 15:04:51 EDT 2002 | bentzen

Hi Greg. FujiCam has two ways of calculating the placement coordinate for a component. - The "FujiCam/Unicam way": calculating component origo as the center of the designed component pads. - Use the PCB designers part origo which could be center of

Printing SPC

Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.

The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 13:31:03 EDT 2002 | seand

Hello all, Dave, this is just another example of how your attitude towards others in the forum, outweighs your open mindedness toward their right to participate....It's SMTnet....not DAVENET. I'm not surprised to see you try to quantify the validit

smt components vs. wave solder

Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF

Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when

Component attrition

Electronics Forum | Mon Dec 23 18:06:38 EST 2002 | jersbo

Tried and True is counting your components if there is any indication of loss... this is a great TOPIC... unfortunately there are many ways to lose components. Feeder setup,problems with a feeder while in the machine(IE mylar problems or wrong step)

PCB Bake

Electronics Forum | Wed Mar 05 22:35:40 EST 2003 | MA/NY DDave

Hi Just a few notes below on this forum the same thing was discussed. It probably would have been better to update that note rather than start a new tread. Hey it makes it easier for all or us and YOU. Check the note out, and also check the archive

Screen Printing for BGA

Electronics Forum | Wed Aug 27 14:41:49 EDT 2003 | Stephen

Have you checked the temperature profile at the balls? Just because a recipe works "fine most of the time" does not mean it is optimum. Do you have a machine that can measure co-planarity? If I get time I plan on using the MPA to look at co-plana

siplace part missing

Electronics Forum | Sat Dec 13 08:03:46 EST 2003 | Stefan Witte

The only part, which could cause component misplacement on the rotary heads of the Siplace machine is the vacuum valve. I don�t know the official name in the part catalog, but I use to name it plunger. The plunger is moved in and out by a miniature s


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