Electronics Forum: check (Page 471 of 631)

Re: Correction about the Head, the Profile Symble

Electronics Forum | Fri Feb 26 14:05:28 EST 1999 | Dave F

Cunli: Registration keeps "booting" me back to the start of restration, because the very nice program doesn't accept any type of company. Keep it. Dave F | For the Head to show, you have to be a registered individual. Even if you registered your

Re: BGA Profile

Electronics Forum | Thu Feb 25 10:17:44 EST 1999 | Joe Cameron

I second Dave's encouragement to use the archives. It's a wealth of info and the search engine usually get's me what I want the first time. By the way, Richard, are you soldering your thermocouple to a ball on the BGA with hi-temp solder? It'd hel

Re: 45 Degree Wave Soldering

Electronics Forum | Mon Mar 01 15:29:16 EST 1999 | Chad Haima

| A rash of new products here at my company have designs with multi-pin connectors 90 out-of-phase (orientation)wiht respect to wave direction, which has lead to massive bridging (shorts) problems.... | | Does anyone still use the 45 Degree Pallet

Re: double reflow

Electronics Forum | Thu Feb 11 09:59:49 EST 1999 | Dave f

| I would like to have information about the processability of different packages. | In particular I would like to known for which package I can use a double reflow for soldering. | | Best Regards | | | Michele: Double sided reflow is common pra

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Forum responses

Electronics Forum | Tue Jan 05 14:32:17 EST 1999 | MARC P

| | Question: If I post a question on the SMT Forum page and someone responds, does the response come directly to me via my e-mail or do I have to keep coming back to the Forum page daily to see if anyone has responded? | | | | Mark, | In this v

Re: Solder Balling

Electronics Forum | Tue Dec 29 04:27:08 EST 1998 | John W

| I have an inbteresting problem on my N2 wave soldering lines. | We have two N2 wave soldering line. Line A is old one and Line B is new. | We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In

Wavesolder Bridging

Electronics Forum | Mon Dec 28 15:43:22 EST 1998 | Mark D.

We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize th

Re: Wavesolder Bridging

Electronics Forum | Mon Dec 28 19:28:57 EST 1998 | Chad Haima

| We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize


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