Electronics Forum: check (Page 531 of 631)

Re: BGA shifting

Electronics Forum | Tue Sep 28 10:29:28 EDT 1999 | Wolfgang Busko

| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re

Re: Wrong Part on Siemens

Electronics Forum | Fri Sep 24 06:38:15 EDT 1999 | pgarsoe

| | Hi All, | | | | We have 19 Siemens machine running here and lately I was assigned to come out with a proposal on the wrong part issue on Siemens Machines. All of our machines are equip with siemens part verification in which there the part barco

Re: Reflowing a thru-hole part

Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup

| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don

Re: Reflow parts moving

Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper

| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting

Re: Reflow parts moving

Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T

| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko

| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source

Re: Serious stuff

Electronics Forum | Wed Aug 18 16:38:41 EDT 1999 | ScottM

| | | OK folks, let's get real serious. | | | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | | | Anyway, I said it would take another

Re: oven ventilation requirements

Electronics Forum | Thu Aug 05 11:27:43 EDT 1999 | Wolfgang Busko

| | We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean

| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We


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