Electronics Forum: check (Page 566 of 631)

Baking time for PCBA rework

Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette

Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no

Rippling effect of stencils

Electronics Forum | Fri Jan 10 15:02:03 EST 2003 | John

Hi. I am familiar with the Transition blades. Normally, when there is metal to metal contact, as in the squeegee-stencil situation, there will be scratches, or a "brush pattern". Sometimes it takes the pattern of the high profile surface elements u

BGA process requirements

Electronics Forum | Thu Apr 11 18:47:43 EDT 2002 | slthomas

A couple of questions to establish a baseline for when the check writers start asking questions........ How many of you have vision systems on site for BGA inspection? If you don't have it, do you do 100% X-ray, or did you just nail down the proces

Board in/out sensors on reflow machines, do they work well?

Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten

They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b

Quad Machines? Good Points / Bad Points

Electronics Forum | Tue Apr 23 12:17:28 EDT 2002 | binns

I have a couple of questions for you, and a couple of answers. 1. Which model ? (100, IIc, IVc, QSV, QSP ) 2. In reference to how the machine stacks up with Fuji and Panasonic. They have never stacked up. Those families of machines have historicall

soldering issues

Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob

Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as

BGA rework

Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil

2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls

non-wetting

Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi

*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about

stencil design software

Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69

Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending

Profiling board

Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf

Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo


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